Electronic device

ABSTRACT

Disclosed are various embodiments related to a bonding member that bonds components of an electronic device. An electronic device may include a tape member that include: a first bonding layer and a second bonding layer. One of the first bonding layer and the second bonding layer comprises a material having a bonding force in a selected range in a predetermined temperature range.

CLAIM OF PRIORITY

This application claims the priority under 35 U.S.C. §119(a) to KoreanApplication Serial No. 10-2015-0028205, which was filed in the KoreanIntellectual Property Office on Feb. 27, 2015, the entire content ofwhich is hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure generally relates to an electronic device thatincludes a tape member.

BACKGROUND

In recent years, the resolutions of the display units, such as, liquidcrystal displays (LCDs) and touch screen panels (TSPs), of portablecommunication devices have rapidly improved. Such display units areincreasingly being provided in portable communication devices, e.g.,mobile terminals such as smartphones and the like.

The display unit may include a window part provided on the body of aportable communication device, and a touch screen panel (TSP) attachedto the lower side of the window part.

The window part and the touch screen panel may be secured in placebetween the window part and the touch screen panel by a bonding film,and are laminated. The touch screen panel and the window part are may beattached to a bracket by a double-sided tape. The double-sided tapeprevents damage to the touch screen panel and has a strong bonding forcesuch that the touch screen panel is bonded to the bracket.

Increasingly, portable communication devices include embedded batterypacks instead of exchangeable battery packs, and when the battery packsare embedded in the portable communication devices, double-sided tape isattached to prevent the movement of the battery packs and the damagethereof due to impacts. That is, the battery packs may be fixed to theportable communication devices by using double-sided tapes.

The other components provided in the portable communication devices alsoare attached mainly by using double-sided tape. The double-sided tapecontains strong bonding forces to fix the battery packs and components.

The above description is provided for background and introductorypurposes. Nothing contained herein is to be construed as an “admission”of prior art. Applicant expressly reserves the right to demonstrate,where appropriate, that the articles and methods referenced herein donot constitute prior art under the applicable statutory provisions.

SUMMARY

Typically, a double-sided tape, implements a strong bonding force to fixa touch screen panel and a window part to a bracket and implements astrong bonding force to fix a battery pack and other components. As aresult, the components may ordinarily be damaged due to the strongbonding force when the components are reassembled and/or disassembled,for example to facilitate repairs. As a result, the bonding forcebecomes weak when the double-sided tape is damaged so that thecomponents cannot be reused.

Meanwhile, when the bonding force of the double-sided tape is lowered toeasily disassemble the components in order to overcome thedisadvantages, the fixing or adhering force between the componentsdeteriorates and the reliability of the product is lowered.

As a result, an apparatus that allows the components to be easilyreassembled and disassembled without the above disadvantages isdesirable.

In an aspect of the present disclosure, a first tape member reactsaccording to a temperature change to vary the bonding force betweencomponents provided in an electronic device, for a substrate, so that afixing force between the components may be improved by maintaining astrong bonding force between the components at a low temperature or ahigh temperature, and the components may be easily reassembled anddisassembled when the components are repaired, by allowing the tapemember to react at a specific temperature within a range (for example,at any temperature between 50° C. to 70° C. inclusive or at one specifictemperature within that range) in order to decrease the bonding force,and a method of manufacturing the same.

In accordance with an aspect of the present disclosure, an electronicdevice may include: an outer housing that includes a first plate and asecond plate that faces an opposite side of the first plate; astructural body that is arrange between the first plate and the secondplate in the outer housing and includes a first surface that faces thefirst plate and a second surface that faces the second plate; componentsthat are arranged between the first and second plates and the first andsecond surfaces of the structural body; and a first tape member that isarranged between the structural body and the components. The first tapemember may include: a first bonding layer that makes contact with atleast some of the components; a second bonding layer that makes contactwith the first and second surfaces; and a substrate that is arrangedbetween the first bonding layer and the second bonding layer, andwherein one of the first bonding layer and the second bonding layerincludes a material having a bonding force in a selected range in aselected temperature range.

In accordance with another aspect of the present disclosure, a method ofmanufacturing a tape member that bonds components provided in anelectronic device may include: manufacturing a substrate; providing afirst bonding layer that bonds the components on one surface of thesubstrate; and providing a second bonding layer that reacts according toa temperature change to vary bonding forces of the components on anopposite surface of the substrate.

According to various embodiments of the present disclosure, a tapemember may react according to a temperature change to vary the bondingforces between components provided in an electronic device is providedin a substrate to maintain a strong bonding force between the componentsat a low temperature or a high temperature, thereby improving fixingforce and secure reliability.

Furthermore, because the tape member reacts at a specific temperature(for example, 50° C. to 70° C.) to lower bonding force so that therelatively high-priced components may be disassembled without beingdamaged by using a relatively low-priced heat chamber to provide a hightemperature environment, the product can be easily reassembled anddisassembled when being repaired, and accordingly, repair costs of theproduct can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more apparent from the following detailed descriptiontaken in conjunction with the accompanying drawings, in which:

FIG. 1 is a perspective view illustrating a front surface of anelectronic device including a plurality of components according to anembodiment of the present disclosure;

FIG. 2 is a perspective view illustrating a rear surface of anelectronic device including a plurality of components according to anembodiment of the present disclosure;

FIG. 3 is a block diagram illustrating a network environment includingan electronic device according to an embodiment of the presentdisclosure;

FIG. 4 is an exploded perspective view illustrating a configuration ofan electronic device including a first tape member according to anembodiment of the present disclosure;

FIG. 5 is a plan view illustrating a configuration of an electronicdevice including a first tape member according to an embodiment of thepresent disclosure;

FIG. 6 is a side sectional view illustrating a configuration of anelectronic device including a first tape member according to anembodiment of the present disclosure;

FIG. 7 is a side sectional view illustrating an operational state of anelectronic device including a first tape member according to anembodiment of the present disclosure;

FIG. 8 is a plan view illustrating a state in which a first tape memberis applied to a flexible display unit according to an embodiment of thepresent disclosure;

FIG. 9 is a plan view illustrating an electronic device including afirst tape member according to another embodiment of the presentdisclosure;

FIG. 10 is a side sectional view illustrating an electronic deviceincluding a first tape member according to another embodiment of thepresent disclosure;

FIG. 11 is a side sectional view illustrating an operational state of anelectronic device including a first tape member according to anotherembodiment of the present disclosure;

FIG. 12 is an exploded perspective view illustrating a configuration ofan electronic device including a first tape member according to anotherembodiment of the present disclosure;

FIG. 13 is a plan view illustrating an electronic device including afirst tape member according to another embodiment of the presentdisclosure;

FIG. 14 is a side sectional view illustrating an electronic deviceincluding a first tape member according to another embodiment of thepresent disclosure;

FIG. 15 is a flowchart illustrating a method of manufacturing a firsttape member according to an embodiment of the present disclosure; and

FIG. 16 is a graph illustrating a change in bonding force according to atemperature of a first tape member according to an embodiment of thepresent disclosure.

DETAILED DESCRIPTION

Hereinafter, various embodiments of the present disclosure will bedescribed in detail. Firstly, terms used in the various embodiments ofthe present disclosure will be briefly described.

With respect to the terms in the various embodiments of the presentdisclosure, the general terms which are currently and widely used areselected in consideration of functions of structural elements in thevarious embodiments of the present disclosure. However, meanings of theterms may be changed according to an inventor's intention, a judicialprecedent, appearance of a new technology, and the like. Further, in acertain case, a term arbitrarily selected by the applicant may be used.In such a case, the meaning of the term will be described in detail atthe corresponding part in the description of the present disclosure.Thus, the terms used in various embodiments of the present disclosureshould be defined based on the meanings of the terms and the overallcontents of the embodiments of the present disclosure instead of simpletitles of the terms.

Although the terms including an ordinal number such as first, second,etc. can be used for describing various elements, the structuralelements are not restricted by the terms. The terms are used merely forthe purpose to distinguish an element from the other elements. Forexample, a first element could be termed a second element, andsimilarly, a second element could be also termed a first element withoutdeparting from the scope of the present disclosure.

Herein, an electronic device that are charged using a wireless chargingdevice according to various embodiments of the present disclosure willbe described. First, the electronic device according to embodiments ofthe present disclosure may be applied to not only all types of mobilecommunication terminals that are operated based on communicationprotocols corresponding to various communication systems, but also alltypes of information and communication devices, multimedia devices, andapplication devices thereof, including a video phone, an electronic book(e-book) reader, a laptop personal computer (PC), a netbook computer, apersonal digital assistant (PDA), a portable multimedia player (PMP), anMP3 (MPEG-1audio layer-3) player, a mobile medical appliance, a camera,or a wearable device (e.g., a head-mounted-device (HMD) such aselectronic glasses, electronic clothes, an electronic bracelet, anelectronic necklace, an electronic accessory, electronic tattoos, or asmart watch).

According to some embodiments, the electronic device may be a smart homeappliance. For example, the smart home appliance may include at leastone of a television, a digital video disk (DVD) player, an audio, arefrigerator, an air conditioner, a vacuum cleaner, an oven, a microwaveoven, a washing machine, an air cleaner, a set-top box, a TV box (e.g.,Samsung HomeSync™, Apple TV™, or Google TV™), a game console, anelectronic dictionary, an electronic key, a camcorder, and an electronicphoto frame.

According to another embodiment, the electronic devices may include atleast one of various medical devices (e.g., a magnetic resonanceangiography (MRA), a magnetic resonance imaging (MRI), a computedtomography (CT) machine, and an ultrasonic machine), navigation devices,global positioning system (GPS) receivers, event data recorders (EDR),flight data recorders (FDR), vehicle infotainment devices, electronicdevices for ships (e.g., navigation devices for ships, andgyro-compasses), avionics, security devices, automotive head units,robots for home or industry, automatic teller's machines (ATMs) inbanks, or point of sales (POS) in shops.

According to some embodiments, the electronic device may include atleast one of furniture or a part of a building/structure, an electronicboard, an electronic signature receiving device, a projector, andvarious types of measuring devices (for example, a water meter, anelectric meter, a gas meter, a radio wave meter and the like) includinga camera function.

An electronic device including a plurality of components according tovarious embodiments of the present disclosure may be a combination ofone or more of the above described various devices. Also, an electronicdevice according to various embodiments of the present disclosure may bea flexible device. Also, an electronic device according to variousembodiments of the present disclosure is not limited to the abovedescribed devices.

FIG. 1 is a perspective view illustrating a front surface of anelectronic device. FIG. 2 is a perspective view illustrating a rearsurface of the electronic device. The electronic device 10 may be asmart phone or a wearable device. Hereinafter, components of anelectronic device, such as a smart phone, will be described withreference to FIGS. 1 and 2.

As illustrated in FIG. 1, a touch screen 11 may be disposed at thecenter of the front surface of the electronic device 10. The touchscreen 11 may occupy most of the front surface of the electronic device10. FIG. 1 illustrates an example in which a main home screen isdisplayed on the touch screen 11. The main home screen is the firstscreen that is displayed on the touch screen 11 when the electronicdevice 10 is turned on. When the electronic device 10 has several pagesof different home screens, the main home screen may be the first of theseveral pages of home screens. Various icons such as short-cut icons forexecuting frequently used applications, a main menu switching key, time,weather, and the like may be displayed on the main home screen. The mainmenu switching key may display a menu screen on the touch screen 11. Astatus bar lld for displaying a status, such as a battery chargingstatus, the strength of a received signal, and the current time, mayalso be formed on the upper end of the touch screen 11. A home key 11 a,a menu button 11 b, and a back button 11 c may be formed on the lowerside of the touch screen 11. The home key 11 a may display the main homescreen on the touch screen 11. For example, when the home key 11 a istouched while any home screen different from the main home screen or themenu screen is displayed, the main home screen may be displayed on thetouch screen 11. If the home key 11 a is touched while applications arebeing executed on the touch screen 11, the main home screen may bedisplayed on the touch screen 11. Also, the home button 11 a may also beused to display recently used applications or a task manager on thetouch screen 11. The menu button 11 b may provide a connectivity menu,which may be used on the touch screen 11. The connectivity menu mayinclude a widget addition menu, a background-switching menu, a searchmenu, an editing menu, and an environment setting menu. The back button11 c may display the screen that was executed immediately before thecurrently executed screen or may terminate the most recently usedapplication.

According to various embodiments of the present disclosure, a firstcamera 12 a, an illumination sensor 12 b, or a proximity sensor 12 c maybe arranged or positioned on an upper end area of the front surface ofthe electronic device 10. A second camera 13 a, a flash 13 b, or aspeaker 13 c may be provided on a rear surface of the electronic device10. If the electronic device 10 is configured such that a battery packis detachable, the bottom surface of the electronic device 10 mayinclude a detachable battery cover 15 which may cover a space 10 b inwhich a battery (not shown) may be releasably secured.

The electronic device 10 that will be described below may be any one ofa wearable device, a notebook, a netbook, a smartphone, a tablet PC, atablet computing device, such as a GALAXY TAB or an iI-PAD. In aparticular embodiment of the present disclosure, the electronic device10 may be a smartphone.

FIG. 3 illustrates a network environment 100 that includes an electronicdevice 10 according to various embodiments.

Referring to FIG. 3, the electronic device 10 may include: a bus 110, aprocessor 120, a memory 130, an input/output interface 140, a displayunit 150, and a communication interface 160. The bus 110 may be acircuit for connecting elements of the electronic device 10 andtransferring communication (for example, a control message) between theelements.

The processor 120 may, for example, receive instructions from the othercomponents (for example, the memory 130, the input/output interface 140,the display unit 150, the communication interface 160, etc.) through thebus 110, decode the received instructions, and carry out operations ordata processing according to the decoded instructions.

The memory 130 may store instructions or data received from, orgenerated by, the processor 120 or the other components, which mayinclude for example, the input/output interface 140, the display unit150, the communication interface 160, and the like.). The memory 130 mayinclude, for example, programming modules, such as a kernel 131,middleware 132, an Application Programming Interface (API) 133, andapplications 134. The programming modules may include software,firmware, hardware, or a combination of two or more thereof.

The kernel 131 may control or manage system resources (for example, thebus 110, the processor 120, and the memory 130) that are used to executeoperations or functions implemented in the other programming modules,such as, for example, the middleware 132, the API 133, and theapplications 134. The kernel 131 may provide an interface through whichthe middleware 132, the API 133, or the applications 134 accessindividual elements of the electronic device 10 to control or manage theelements.

The middleware 132 may function as an intermediary that allows the API133 or the applications 134 to communicate with the kernel 131 toexchange data. With respect to task requests received from theapplications 134, the middleware 132 may, for example, execute a control(for example, scheduling or load balancing) for the task requests usinga method of assigning a priority to use system resources of theelectronic device 10 (for example, the bus 110, the processor 120, andthe memory 130) to at least one of the applications 134.

The API 133 is an interface used, by the application 134, to control afunction provided from the kernel 131 or the middleware 132, and mayinclude, for example, at least one interface or function (for example,an instruction) for file control, window control, image processing,and/or text control.

According to various embodiments of the present disclosure, theapplications 134 may include a short message service (SMS)/multimediamessage service (MMS) application, an e-mail application, a calendarapplication, an alarm application, a health care application (forexample, an application for measuring a work rate or blood sugar), andan environment information application (for example, an application forproviding atmospheric pressure, humidity, or temperature information).Additionally or alternatively, the applications 134 may be anapplication associated with information exchange between the electronicdevice 10 and an external electronic device (for example, an electronicdevice 104). The application associated with the exchange of informationmay include, for example, a notification relay application fortransferring specific information to an external electronic device or adevice management application for managing an external electronicdevice.

For example, the notification relay application may have a function offorwarding, to an external electronic device (for example, theelectronic device 104), notification information generated from otherapplications of the electronic device 10 (for example, an SMS/MMSapplication, an e-mail application, a health care application, and anenvironmental information application). Additionally or alternatively,the notification relay application may, for example, receivenotification information from an external electronic device (forexample, the electronic device 104) and may provide the receivednotification information to a user. The device management applicationmay, for example, manage (for example, install, delete, or update) afunction for at least a part of an external electronic device (forexample, the electronic device 104) communicating with the electronicdevice 10 (for example, activating/deactivating the external electronicdevice itself (or some components thereof) or adjusting the brightness(or resolution) of a display), an application operating in the externalelectronic device, and/or a service provided from the externalelectronic device (for example, a telephone call service or a messageservice).

According to various embodiments of the present disclosure, theapplications 134 may include an application specified according to theproperty (for example, type) of an external electronic device (forexample, the electronic device 104). For example, when the externalelectronic device is an MP3 player, the applications 134 may include anapplication relating to the reproduction of music. Similarly, in caseswhere the external electronic device is a mobile medical device, theapplications 134 may include an application relating to health care.According to an embodiment of the present disclosure, the applications134 may include at least one of the applications specified to theelectronic device 10 or applications received from an externalelectronic device (for example, a server 106 or the electronic device104).

The input/output interface 140 may forward instructions or data input bya user through an input/output device (for example, a sensor, akeyboard, or a touch screen) to the processor 120, the memory 130, andthe communication interface 160 through the bus 110. For example, theinput/output interface 140 may provide the processor 120 with datacorresponding to a user touch input through a touch screen. Theinput/output interface 140 may, for example, output instructions or datareceived through the bus 110 from the processor 120, the memory 130, andthe communication interface 160 through an input/output device (forexample, a speaker or display). The input/output interface 140 mayinclude an audio module.

The display unit 150 may display various types of information (forexample, multimedia data, and text data) to a user.

The communication interface 160 may connect communication between theelectronic device 10 and an external electronic device (for example, theelectronic device 104 or the server 106). For example, the communicationinterface 160 may be connected to a network 162 through wireless orwired communication to communicate with the external device. Thewireless communication may include, for example, at least one ofwireless fidelity (Wi-Fi), Bluetooth (BT), near field communication(NFC), a global positioning system (GPS), and cellular communication(for example, LTE, LTE-A, CDMA, WCDMA, UMTS, WiBro, GSM, etc,). Thewired communication may include at least one of, for example, auniversal serial bus (USB), a high definition multimedia interface(HDMI), recommended standard 232 (RS-232), and a plain old telephoneService (POTS).

According to an embodiment of the present disclosure, the network 162may be a telecommunication network. The telecommunication network mayinclude at least one of a computer network, the Internet, Internet ofThings, and a telephone network. According to an embodiment of thepresent disclosure, a protocol for communication between the electronicdevice 10 and an external device (for example, a transport layerprotocol, a data link layer protocol, or a physical layer protocol) maybe supported by at least one of the applications 134, the API 133, themiddle ware 132, the kernel 131, and the communication interface 160.

According to various embodiments of the present disclosure, a controllermay include the processor 120 and the memory 130 for storing informationrequired by the processor 120. The controller is a central processingunit that controls the overall operations of the electronic device 10.

The electronic device 10 (see FIG. 1), according to various embodimentsof the present disclosure, may have a plurality of components therein asdescribed above. That is, the components may be attached by means of afirst tape member according to the present disclosure. The componentsmay be attached by other bonding means in addition to the first tapemember 200 (see FIG. 4) according to the present disclosure. Forexample, the tape member may include a double-sided bonding tape.

As illustrated in FIG. 4, the components, according to variousembodiments of the present disclosure, may include any one or all of awindow part 100 a, a touch panel 100 b, a display module, a flexibledisplay unit 100 f (see FIG. 8), an LCD, a support frame 100 c, abattery pack 100 d, and a rear case 100 e. The embodiment of the presentdisclosure is not limited to the disclosed components 100 a to 100 e.That is, other components, in addition to the disclosed components, maybe included as long as they are components 100 a to 100 e that arebonded by using the first tape member 200.

In addition, the design of the display unit of the electronic device maybe implemented more luxuriously while a bezel area is minimized or thedisplay unit is made larger. A flexible display unit may be provided, ora convex or concave display unit may be implemented.

That is, a peripheral portion of the display unit is bent such that theviewing area may be enlarged to a side surface of the electronic device.As the viewing area of the display unit is bent to be enlarged to theside surface of the electronic device, the viewing area may be enlargedor a separate screen may be used on the side surface, and the design ofthe display unit may be implemented luxuriously. That is, the displayunit includes a first view area and a second view area provided onopposite side surfaces of the first screen area.

FIG. 4 is an exploded perspective view illustrating a configuration ofan electronic device 10 that includes a first tape member 200 accordingto various embodiments of the present disclosure. FIG. 5 is a plan viewillustrating a configuration of an electronic device 10 including afirst tape member 200 according to various embodiments of the presentdisclosure.

Referring to FIGS. 4 and 5, the electronic device 10 includes an outerhousing that includes a first plate and a second plate that faces anopposite side of the first plate, a structural body that is arrangedbetween the first plate and the second plate in the outer housing andincludes a first surface that faces the first plate and a second surfacethat faces the second plate, components that are arranged between thefirst and second plates and the first and second surfaces, and a firsttape member arranged between the structural body and the components.

The first plate includes a window part 100 a, and the second plateincludes a rear case 100 e. The components include a display module anda battery pack 100 d. The display module may include a touch panel 100b.

The first tape member 200 includes a substrate 210 and first and secondbonding layers 220 and 230.

The substrate 210 may be provided between the first and second bondinglayers 220 and 230, which will be described below, such that the firstand second bonding layers 220 and 230, which will be described below,are provided.

The first bonding layer 220 may be provided on one surface of thesubstrate 210 to make contact with at least some of the components. Thesecond bonding layer 230 may be provided on an opposite surface of thesubstrate 210 to make contact with the first and second surfaces of thestructural body.

One of the first bonding layer 220 and the second bonding layer 230 maybe formed of a material that has a bonding force within a range selectedfrom a selective temperature range.

That is, one of the first bonding layer 220 and the second bonding layer230 reacts according to a change in the selective temperature (forexample, 50° C. to 70° C.) to vary the boding force between thecomponents 100 a to 100 e.

In the selected temperature range, one of the first bonding layer 220and the second bonding layer 230 may have a bonding force that is weakerthan that of the remaining one of the first bonding layer 220 and thesecond bonding layer 230.

In the embodiment of the present disclosure, if the second bonding layer230 is selectively described among the first bonding layer 220 and thesecond bonding layer 230, the second bonding layer 230 is provided onthe opposite surface of the substrate 210 to increase the bonding forceat a low or high temperature and to react according to the selectedtemperature change to lower a bonding force between the components 100 ato 100 e as well, so that the reliability of the electronic device 10can be secured by improving a fixing force between the components 100 ato 100 e and the components can be conveniently reassembled anddisassembled when the components 100 a to 100 e are repaired.

The second bonding layer 230 may include a material that has a bondingforce in the selected range in the selected temperature range. Thematerial may include a thermally reactive bonding layer.

It is preferable that the material of the substrate 210 include any oneof Poly Ethylenetere Phthalate (PET), Poly Methyl Methacrylate (PMMA),and Poly Carbonate (PC). The material of the substrate 210 may be amaterial other than the disclosed materials. For example, the substrate210 may be formed of a metallic material such as a copper (Cu) sheet oran aluminum (Al) sheet.

The material of the first and second bonding layers 220 and 230 may bean acryl based adhesive. The first and second bonding layers may includean adhesive other than the acryl based adhesive. For example, the firstand second bonding layers 220 and 230 may include a rubber basedadhesive, a vinyl alkyl ether based adhesive, a silicon based adhesive,a polyester based adhesive, a polyamide based adhesive, a urethane basedadhesive, a fluorine based adhesive, and an epoxy based adhesive.

The first bonding layer 220 may maintain a strong bonding force at a lowor high temperature. The first bonding layer 220 may maintain a strongbonding force at a temperature within the range of −40° C. to 80° C.inclusive.

The bonding force of the first bonding layer 220 in the selected rangemay be within 2500 gf to 4000 gf inclusive at a temperature between −40°C. to 80° C. inclusive.

The second bonding layer 230 increases the bonding force at a low orhigh temperature, and reacts at 50° C. to 70° C. to lower bonding force.That is, the second bonding layer 230 maintains a strong bonding forceat a temperature within a range of −40° C. to 80° C. inclusive , and thesecond bonding layer 230 lowers bonding force when being heated at atemperature within a range of 50° C. to 70° C. inclusive.

The bonding force of the second bonding layer 230 in the selected rangemay be 2500 gf to 4000 gf at a low or high temperature, and may be 200gf to 1000 gf inclusive at temperature within the range of 50° C. to 70°C. inclusive.

That is, when the bonding force of the second bonding layer 230 islowered to a temperature within the range of 50° C. to 70° C. inclusive,the components are separated from the second bonding layer 230.

As illustrated in FIG. 5, the first tape member 200 is provided in afirst area A1 formed on the inside of the components 100 a to 100 e ofthe electronic device 10, and is not provided in a second area A2 formedat an outer circumference of the components of the electronic device 10.The second area A2 may be a structural part that is vulnerable to damageto a sealed part, an assembled part, and the like of the componentsthemselves, and may be an avoidance area or a mounting area foradditionally mounting other components.

A plurality of auxiliary materials 101 that provide various performancesmay be provided between the panel 100 b and the first bonding layer 220,and the auxiliary materials 101 may include an impact absorbingauxiliary material, a heat radiation auxiliary material, and aconductive auxiliary material.

The conductive auxiliary material may include any one of a copper (CU)sheet and an aluminum (Al) sheet. While as described herein, theconductive auxiliary material may include a copper (CU) sheet and analuminum (Al) sheet, it is to be understood that the present disclosureis not limited thereto. That is, various conductive sheets which may beformed from other materials, through which current flows, may be appliedas the conductive auxiliary material.

FIG. 8 is a plan view illustrating a state in which the first tapemember 200 according to the present disclosure is applied to a flexibledisplay unit 100 f of the electronic device 10.

As illustrated in FIG. 8, the tape member 200 may be provided incomponents (not illustrated) provided in the flexible display unit 100f.

That is, the first tape member 200 is provided in both of the first andsecond areas formed on the outside and inside of the components. Thatis, the first tape member 200 has substantially the same size as theflexible display unit 100 f and is attached to the flexible display unit100 f.

FIG. 9 is a plan view illustrating a first tape member 200 according toanother embodiment of the present disclosure. FIG. 10 is a sidesectional view illustrating a first tape member according to anotherembodiment of the present disclosure. FIG. 11 is a side sectional viewillustrating an operational state of a first tape member according tothe present disclosure.

As illustrated in FIGS. 9 to 11, the first tape member 200 may includefirst and second bonding parts 200 a and 200 b. Each of the first andsecond bonding parts 200 a and 200 b includes a substrate 210, a firstbonding layer 220, and second bonding layer parts 231 and 232.

The first bonding part 200 a may be provided in a first area A1 formedon the inside of each of the components 100 a, 100 b, and 100 c of theelectronic device 10.

The second bonding part 200 b may be provided in a second area A2 formedon the outside of the components 100 a, 100 b, and 100 c of theelectronic device 10 and may have a bonding force that is lower thanthat of the first bonding part 220.

As illustrated in FIG. 11, the first bonding part 200 a is attached tothe inside of the components 100 a, 100 b, and 100 c of the electronicdevice 10 and forms a bonding force that is stronger than that of thesecond bonding part 200 b, and the second bonding part 200 b is attachedto the outside of the electronic device 10 and forms a bonding forcethat is weaker than that of the first bonding part 200 a.

That is, the second bonding layer 232 of the second bonding part 200 bforms a bonding force that is weaker than that of the second bondinglayer 231 of the first bonding part 200 a.

Accordingly, because the components 100 a, 100 b, and 100 c of theelectronic device 10 are easily damaged at a release start point whenthe components are released, the components 100 a, 100 b, and 100 c maybe conveniently separated without being damaged by weakening the bondingforce of the second bonding part 200 b located at the release startpoint when the components are released. In this way, if it is desired tomore easily disassemble the components in an initial release directionwhen the components are released, the strengths of the bonding forces ofthe first and second bonding parts 200 a and 200 b, which are providedin the first and second areas A1 and A2 on the inside and outside of theelectronic device 10, are differently formed.

In addition, as illustrated in FIG. 9, an isolated part C1 is providedat upper ends of the components 100 a and 100 b. The isolated part C1 isan area that does not have a bonding force to arrange components, suchas a display module, or for forming a conductive part (not illustrated).That is, the separated part C1 may be separately provided as an areairrelevant to a bonding structure.

FIG. 12 is an exploded perspective view illustrating a configuration ofa first tape member 300 provided in an electronic device 10 according toanother embodiment of the present disclosure. FIG. 13 is a plan viewillustrating of a first tape member 300 provided in an electronic device10 according to another embodiment of the present disclosure. FIG. 14 isa side sectional view illustrating a first tape member 300 provided inan electronic device 10 according to another embodiment of the presentdisclosure.

As illustrated in FIGS. 12 to 14, the first tape member 200 includes asubstrate 310 and a second bonding layer 330.

The components of the electronic device 10 includes a window part 100 a(see FIG. 4) and a structural body 100 c, and auxiliary materials 101having various performances are provided between the panel 100 b (seeFIG. 4) and the structural body 100 c and include an impact absorbingauxiliary material, a heat radiation auxiliary material, and aconductive auxiliary material.

The impact absorbing auxiliary material includes a mesh and sponge, andthe heat radiation auxiliary material includes graphite. The conductivemember may include a copper (CU) sheet.

A plurality of through-holes 101 a are formed in the auxiliary materials101, and an upper surface and side surfaces of the substrate 310 passthrough the through-holes 101 a to be coupled. Because a second bondinglayer 330 bonded to the structural body 100 c is provided on the lowersurface of the substrate 310, the lower surface of the substrate 310coupled to the through-hole 101 a is bonded to the structural body 100c. Then, the second bonding layer 330 provided on the lower surface ofthe substrate 310 may be bonded to the structural body 100 c.

When the components 100 a, 100 b, and 100 c of the electronic device 10coupled in this way are to be disassembled, the components 100 a, 100 b,and 100 c are inserted into and heated in a low-priced heat chamber (notillustrated). If the temperature of the components reaches 50° C. to 70°C. when the components are heated, the second bonding layer 330 reactsto lower bonding force. That is, because the bonding force of the secondbonding layer 330 is lowered to 200 gf to 1000 gf at 50° C. to 70° C.,the second bonding layer 330 is easily separated from the structuralbody 100 c. The auxiliary materials 101 are separated together with thesecond bonding layer 330.

Accordingly, the second bonding layer 300 may allow the components 100a, 100 b, and 100 c of the electronic device 10 to be easily separated.

Hereinafter, the first tape member 200 that attaches the components 100a to 100 e (see FIG. 4) of the electronic device 10 will be described inmore detail with reference to FIGS. 6 and 7.

FIG. 6 is a side sectional view illustrating a configuration of anelectronic device 10 including a first tape member 200 according to thepresent disclosure. FIG. 7 is a side sectional view illustrating aseparated state of an electronic device 10 including a first tape member200 according to various embodiments of the present disclosure.

As illustrated in FIG. 6, the first tape member 200 includes a substrate210, and first and second bonding layers 220 and 230. A first bondinglayer 220 is provided on one surface of the substrate 210 and a secondbonding layer 230 is provided on an opposite surface of the substrate210.

In this state, as illustrated in FIG. 4, which has been mentioned above,a display module may include a touch panel 100 b that is bonded to thefirst bonding layer 220, and auxiliary materials 101 including an impactabsorbing auxiliary material, a heat radiation auxiliary material, and aconductive auxiliary material are provided between the first bondinglayer 220 and the touch panel 100 b.

As illustrated in FIG. 4, which has been mentioned above, a firstsurface of the structural body 100 c is bonded to the second bondinglayer 230. The second bonding layer 230 is bonded to an upper side ofthe structural body and a first bonding layer 220 of another first tapemember 200 is attached to a second surface formed on a lower side of thestructural body 100 c. A second bonding layer 230 of another first tapemember 200 is bonded to the battery pack 100 d.

Here, when the electronic device 10 is to be disassembled and repairedto be reused, the electronic device 10 is introduced into a low-pricedheat chamber (not illustrated) and is heated.

Because the second bonding layer 230 reacts according to a specifictemperature change to lower bonding force when the low-priced heatchamber is heated to 50° C. to 70° C. inclusive, the bonding force ofthe second bonding layer 230 is lowered to 200 gf to 1000 gf inclusiveat a specific temperature of 50° C. to 70° C. inclusive. Then, becausethe second bonding layer 230 of the first tape member 200 is bonded tothe structural body 100 c, the second bonding layer 230 and thestructural body 100 c are separated from each other when the bondingforce of the second bonding layer 230 is lowered to 200 gf to 1000 gfinclusive. The second bonding layer 230, of which the bonding force islowered, is easily separated from the structural body 100 c togetherwith the window part and the touch panel 100 b.

In this way, the high-priced display unit and the structural body 100 care easily separated without being damaged by the second bonding layer230.

Similarly, a battery pack 100 d bonded to the lower side of thestructural body 100 c by another first tape member 200 is separated.That is, because the bonding force of the second bonding layer 230 ofthe first tape member 200 is lowered to 200 gf to 1000 gf at 50° to 70°inclusive, the structural body and the battery pack 100 d are easilyseparated by the second bonding layer 230.

If the electronic device 10 is completely repaired, the components 100 ato 100 e of the electronic device 10 are bonded again by using the firsttape member 200, and if the electronic device 10 is introduced into thelow-priced heat chamber (not illustrated) and is heated at a lowtemperature of 50° C. or less or a high temperature of 70° C., thesecond bonding layer 230 of the first tape member 200 recovers theinitial strong bonding force. Accordingly, the second bonding layer 230maintains a strong bonding force again, and fixes the components 100 ato 100 e of the electronic device 10 and improves reliability.

Hereinafter, a method of manufacturing a first tape member 200 accordingto various embodiments of the present disclosure will be described indetail. First, FIG. 15 is a view illustrating a method of manufacturinga first tape member 200 according to the present disclosure.

As illustrated in FIG. 15, first, a substrate 210 including one of thematerials that are disclosed below is manufactured (S1).

It is preferable that the material of the substrate 210 includes any oneof Poly Ethylenetere Phthalate (PET), Poly Methyl Methacrylate (PMMA),and Poly Carbonate (PC).

A first bonding layer 220 is provided on one surface of the substrate210 manufactured in S1 (S2).

From S2, a second bonding layer 230 that reacts according temperaturechange and varies the bonding forces of the components of the electronicdevice 10 is provided on an opposite surface of the substrate 210 (S3).

The second bonding layer 230 includes a thermally reactive bonding layerthat increases bonding force at a low or high temperature, and reacts at50° C. to 70° C. inclusive to lower bonding force.

The bonding force of the first bonding layer 220 is 2500 gf to 4000 gf.

The bonding force of the second bonding layer 230 is 2500 gf to 4000 gfat a low temperature (e.g., 20° C. to 50° C. inclusive) or hightemperature (e.g., 50° C. to 70° C. inclusive), and is 200 gf to 1000 gfinclusive at 50° C. to 70° C. inclusive.

The tape member 200 manufactured in this way bonds a display unitincluding a window part 100 a and a touch panel 100 b by the firstbonding layer 220, and bonds the structural body 100 c by the secondbonding layer 230. The second bonding layer 230 is bonded to an upperside of the structural body 100 c and a second bonding layer 230 ofanother first tape member 200 is attached to a second surface formed ona lower side of the structural body 100 c. A second bonding layer 230 ofanother first tape member 200 bonds the battery pack 100 d. A rear case100 e is coupled to a lower side of the structural body 100 c.

Here, when the electronic device 10 is to be disassembled and repairedto be reused, the electronic device 10 is introduced into a low-pricedheat chamber (not illustrated) and is heated.

Because the second bonding layer 230 reacts according to a specifictemperature change to lower the bonding force when the low-priced heatchamber is heated to 50° C. to 70° C. inclusive, the bonding force ofthe second bonding layer 230 is lowered to 200 gf to 1000 gf at aspecific temperature of 50° C. to 70° C. Then, because the secondbonding layer 230 of the first tape member 200 is bonded to thestructural body 100 c, the second bonding layer 230 and the structuralbody 100 c are separated from each other when the bonding force of thesecond bonding layer 230 is lowered to 200 gf to 1000 gf inclusive. Thesecond bonding layer 230, of which the bonding force is lowered, iseasily separated from the structural body 100 c together with the windowpart 100 a and the touch panel 100 b.

In this way, the high-priced display unit and the structural body 100 care easily separated without being damaged by the second bonding layer230.

Similarly, a battery pack 100 d bonded to the lower side of thestructural body 100 c by another first tape member 200 is separated.That is, because the bonding force of the second bonding layer 230 ofthe other tape member 200 is lowered to 200 gf to 1000 gf inclusive at50° to 70° inclusive, the structural body 100 c and the battery pack 100d are easily separated by the second bonding layer 230.

According to various embodiments of the present disclosure, FIG. 16 is agraph depicting a change in the bonding force according to thetemperatures of the first tape 200 and 300, according to the presentdisclosure, and a tape member according to the related art.

As illustrated in FIG. 16, the first tape member 200 or 300, accordingto the present disclosure, exhibits a strong bonding force of between2000 gf to 25000 gf inclusive in a low temperature section of 20° C. to50° C. and exhibits a weak bonding force of 200 gf to 1000 gf in asection of 50° C. to 70° C. Accordingly, the first tape member,according to the present disclosure, can allow the components of theelectronic device 10 to be easily disassembled in a section of 50° C. to70° C.

To the contrary, according to the related art, because a tape membermaintains an initial bonding force in a section having a temperaturerange of 50° C. to 70° C. inclusive, high-priced components can bedamaged when the components of the electronic device 10 aredisassembled.

Accordingly, because the tape member (e.g., tape member 200 or 300),according to the present disclosure, reacts in a selected temperaturerange to the lower bonding force so that high-priced components may bedisassembled without being damaged only by a low-priced heat chamber(not illustrated) in a high temperature environment, the product can beeasily reassembled and disassembled when the product is repaired and therepair costs of the product can be reduced.

It will be apparent to those skilled in the art that the electronicdevice having a tape member according to various embodiments of thepresent disclosure is not limited to the above described embodiments anddrawings, and various modifications, changes, and substitutions may bemade thereto without departing from the spirit and scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. An electronic device comprising: an outer housingthat comprises a first plate and a second plate that faces an oppositeside of the first plate; a structural body that is disposed between thefirst plate and the second plate in the outer housing and comprises afirst surface that faces the first plate and a second surface that facesthe second plate; at least one component that is arranged between thefirst and second plates and the first and second surfaces of thestructural body; and a first tape member that is positioned between thestructural body and the at least one component, wherein the first tapemember comprises: a first bonding layer that makes contact with the atleast one component; a second bonding layer that makes contact with thefirst and second surfaces; and a substrate that is disposed between thefirst bonding layer and the second bonding layer, and wherein one of thefirst bonding layer and the second bonding layer comprises a materialhaving a bonding force in a selected range at a predeterminedtemperature range.
 2. The electronic device of claim 1, wherein in thepredetermined temperature range, the one of the first bonding layer andthe second bonding layer has a bonding force that is weaker than that ofa remaining one of the first bonding layer and the second bonding layer.3. The electronic device of claim 1, wherein the component comprises adisplay module.
 4. The electronic device of claim 1, wherein the firstbonding layer comprises a material having the bonding force in theselected range at the predetermined temperature range.
 5. The electronicdevice of claim 1, wherein the component comprise a battery pack.
 6. Theelectronic device of claim 1, wherein the second bonding layer comprisesa material having the bonding force in the selected range at thepredetermined temperature range.
 7. A method of repairing an electronicdevice, the method comprising: providing the electronic device, theelectronic device comprising: an outer housing that comprises a firstplate and a second plate that faces an opposite side of the first plate;a structural body that is disposed between the first plate and thesecond plate in the outer housing and comprises a first surface thatfaces the first plate and a second surface that faces the second plate;a plurality of components that is arranged between the first and secondplates and the first and second surfaces of the structural body; and afirst tape member that is positioned between the structural body and thecomponents, wherein the first tape member comprises: a first bondinglayer that makes contact with at least some of the components; a secondbonding layer that makes contact with the first and second surfaces; anda substrate that is disposed between the first bonding layer and thesecond bonding layer, and wherein one of the first bonding layer and thesecond bonding layer comprises a material having a bonding force in aselected range at a predetermined temperature range; heating theelectronic device in the predetermined temperature range; and separatingthe components of the electronic device from the electronic device. 8.The electronic device of claim 1, wherein a bonding force of the secondbonding layer is increased at a predetermined temperature, and thesecond bonding layer reacts at 50° C. to 70° C. to lower a bondingforce.
 9. The electronic device of claim 1, wherein a bonding force ofthe first bonding layer is within a range of 2500 gf to 4000 gfinclusive.
 10. The electronic device of claim 1, wherein a bonding forceof the second bonding layer is within a range of 2500 gf to 4000 gfinclusive at a low temperature within a range of 20° C. to 50° C.inclusive or a high temperature of 70° C. and is within a range of 200gf to 1000 gf inclusive at a temperature range of 50° C. to 70° C.inclusive.
 11. The electronic device of claim 1, wherein the componentsof the electronic device comprise any one of a window part, a touchpanel, a flexible display unit, an LCD, and an external appearancemember.
 12. The electronic device of claim 1, wherein the first tapemember is provided in a first area formed on the inside of thecomponents of the electronic device, and is not provided in a secondarea formed at an outer circumference of the components of theelectronic device.
 13. The electronic device of claim 1, wherein thefirst tape member is provided in both of the first and second areasformed on the outside and inside of the components of the electronicdevice.
 14. The electronic device of claim 1, wherein the first tapemember comprises first and second bonding parts, the first bonding partis provided in a first area formed on the inside of the components ofthe electronic device, and the second bonding part is provided in asecond area formed on the outside of the components of the electronicdevice and forms a bonding force that is weaker than that of the firstbonding part.
 15. The electronic device of claim 14, wherein the secondbonding layer of the second bonding part forms a bonding force that isweaker than that of the second bonding layer of the first bonding part.16. The electronic device of claim 1, wherein an impact absorbingauxiliary material, a heat radiation auxiliary material, and aconductive auxiliary material are provided between the components. 17.The electronic device of claim 16, wherein an upper surface and sidesurfaces of the substrate pass through a plurality of through-holesformed in the auxiliary materials, and a second bonding layer bonded tothe components is provided on a lower surface of the substrate.
 18. Amethod of manufacturing a tape member that bonds components provided inan electronic device, the method comprising: manufacturing a substrate;providing a first bonding layer that bonds the components on one surfaceof the substrate; and providing a second bonding layer that reactsaccording to a temperature change to vary bonding forces of thecomponents on an opposite surface of the substrate.
 19. The method ofclaim 18, wherein a bonding force of the second bonding layer isincreased at a predetermined temperature, and the second bonding layercomprises a thermally reactive bonding layer that reacts at temperaturerange of 50° C. to 70° C. inclusive to lower bonding force.
 20. Themethod of claim 17, wherein a bonding force of the second bonding layeris within a range of 2500 gf to 4000 gf inclusive at a predeterminedtemperature and is 200 gf to 1000 gf at 50° C. to 70° C.